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Dry Film

Dry film photo-resist (DFPR), is the key component used in the image transfer process. It is widely used in industries such as Printed Circuit Board (Rigid board, Flexible, HDI, etc), Lead Frame, Chemical milling, IC Substrate, IC packaging, etc.

Eternal dry film photo-resists are available in thicknesses from 15 to 100 microns.

With strong in-house R&D capabilities we are able to design and develop dry film products to specifically match our customers’ requirements for various processes such as Chemical Milling and Electroforming etc.
Dry film photoimageable Solder Mask used for the FPC/Multi-PCB、IC substrate or other Rigid-Board in the manufacturing process of photolithography industry.

DFSM can be Laminated on the board, exposed to the pattern and developed to provide openings in the pattern for parts to be soldered to the copper pads. Eternal is well equipped to meet customers’ special application requirements.

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